IRF7779L2PBF mosfet equivalent, power mosfet.
square Cu board (still air).
Mounted on minimum footprint full size board with metalized back and with small clip heatsink. (still air)
3
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PCB assembly equipment and vapor phase, infra-red or convection soldering techniques, when application note AN-1035 is .
The IRF7779L2TR/TR1PbF combines the latest HEXFET® Power MOSFET Silicon technology with the advanced DirectFETTM packaging to
achieve the lowest on-state resistance in a package that has a footprint smaller than a D2PAK and only 0.7 mm profile. The .
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